A series of high-level professional forums and industrial activities will be held concurrently, bringing together top global scientists, industry leaders, and technical experts to discuss the future of computing power:

1. Hangzhou AI Computing Power Industry Development Summit Forum

Interpreting global computing power policy directions, market trends, technological breakthroughs, and industrial landscapes; exploring pathways for high-quality development of the intelligent computing industry.

2. AI Large Models and Intelligent Computing Center Construction Summit

Focusing on core topics such as computing power requirements for large model training, planning and design of intelligent computing centers, efficient computing power scheduling, and the construction of domestic computing ecosystems.

3. Green Computing and Liquid Cooling Technology Conference

Centered on high-density computing heat dissipation, large-scale application of liquid cooling technology, low PUE intelligent computing centers, integration of renewable energy, and carbon peaking/carbon neutrality practices.

4. Computing Power Network and Computing-Network Integration Development Forum

Discussing computing power network architecture, 800G/1.6T optical communications, edge computing power, distributed computing power, and computing scheduling/data transmission technologies.

5. AI Computing Power Industry Application Matchmaking Meeting

Organizing precise supply-demand matchmaking for computing power in fields such as intelligent manufacturing, smart healthcare, fintech, autonomous driving, and digital government.

6. New Product Launches and Technology Innovation Roadshows

Supporting enterprises in hosting debuts of new AI chips, servers, intelligent computing solutions, and large models, as well as technology roadshows and partnership signings.

7. Computing Power Industry Talent Exchange Conference

Building a talent matchmaking platform connecting universities with enterprises and facilitating business-to-business hiring to recruit high-end technical talents in computing architecture, chip R&D, and intelligent computing operations.